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Communications Chipset 8900, 8903, 8910, and 8920: Thermal Mechanical Design Guide

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Intel® Communications Chipset 89xx Series: Design Guide

Introduction
Power dissipation requirements for electronic components have risen with the increase in complexity of computer systems. To ensure quality, reliability, and performance goals are met over a product's life cycle, the heat generated by the component must be properly dissipated. Typical methods to improve heat dissipation include selective use of airflow ducting, and/or the use of heatsinks.

The goals of this document are to:

• Describe the thermal and mechanical specifications for the Intel® Communications Chipset 89xx Series.
• Describe reference solutions that meet the thermal and mechanical specifications of the Intel® Communications Chipset 89xx Series.

Read the full Intel® Communications Chipset 89xx Series Design Guide.

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