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® Intel I/O Controller Hub 7 (ICH7) Thermal Design Guidelines ® — For the Intel 82801GB ICH7 and 82801GR ICH7R I/O Controller Hubs April 2005 Document Number: 307015-001 THIS DOCUMENT AND RELATED MATERIALS AND INFORMATION ARE PROVIDED "AS IS” WITH NO WARRANTIES, EXPRESS OR IMPLIED, INCLUDING BUT NOT LIMITED TO ANY IMPLIED WARRANTY OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE, NON-INFRINGEMENT OF INTELLECTUAL PROPERTY RIGHTS, OR ANY WARRANTY OTHERWISE ARISING OUT OF ANY PROPOSAL, SPECIFICATION, OR SAMPLE. INTEL ASSUMES NO RESPONSIBILITY FOR ANY ERRORS CONTAINED IN THIS DOCUMENT AND HAS NO LIABILITIES OR OBLIGATIONS FOR ANY DAMAGES ARISING FROM OR IN CONNECTION WITH THE USE OF THIS DOCUMENT. Intel products are not intended for use in medical, life saving, life sustaining, critical control or safety systems, or in nuclear facility applications. Intel Corporation may have patents or pending patent applications, trademarks, copyrights, or other intellectual property rights that relate to the presented subject matter. The furnishing of documents and other materials and information does not provide any license, express or implied, by estoppel or otherwise, to any such patents, trademarks, copyrights, or other intellectual property rights. Intel may make changes to specifications and product descriptions at any time, without notice. Intel is not obligated to provide any support, installation or other assistance with regard to the information or products made in accordance with it. ® I/O Controller Hub 7 (ICH7) component may contain design defects or errors known as errata, which may cause the The Intel product to deviate from published specifications. Current characterized errata are available on request. Intel, Pentium, and the Intel logo are trademarks or registered trademarks of Intel Corporation or its subsidiaries in the United States and other countries. *Other names and brands may be claimed as the property of others. Copyright © 2005 Intel Corporation. All rights reserved. 2 ® I/O Controller Hub 7 (ICH7) Thermal Design Guide Intel Contents 1 2 3 4 5 Appendix A Appendix B Introduction..........................................................................................................................7 1.1 Terminology ............................................................................................................8 1.2 Reference Documents............................................................................................8 Product Specifications.........................................................................................................9 2.1 Package Description...............................................................................................9 2.2 Thermal Specifications ...........................................................................................9 2.3 Power Specifications ............................................................................................11 Thermal Metrology.............................................................................................................13 3.1 Case Temperature Measurements.......................................................................13 3.2 0° Angle Thermocouple Attach Methodology .......................................................13 3.3 Ambient Temperature and Airflow Measurement.................................................14 Alternative Heatsink Determination Guidance ..................................................................17 4.1 Configurations Supported in this Methodology.....................................................17 4.2 System Configuration for T Analysis...................................................................18 C 4.3 Heatsink Determination Procedure.......................................................................18 4.3.1 Procedure Description...........................................................................18 4.3.2 Application.............................................................................................20 4.4 Heatsink Adequacy Determination Procedure .....................................................21 4.4.1 Procedure Description...........................................................................21 4.4.2 Application.............................................................................................22 Reference Thermal Solution..............................................................................................23 5.1 Environmental Reliability Requirements...............................................................23 Enabled Suppliers .............................................................................................................25 Mechanical Drawings ........................................................................................................27 ® I/O Controller Hub 7 (ICH7) Thermal Design Guide Intel 3 Figures Figure 1. 0° Angle Attach Methodology (Top View, Not to Scale) ....................................14 Figure 2. 0° Angle Attach Heatsink Modifications (Generic Heatsink Shown, Not to Scale) 14 Figure 3. Recommended Temperature Measurement Placement (Top View) .................15 Figure 4. Recommended Airflow and Temperature Placement (Side View) ....................15 Figure 5. Heatsink Determination Chart (Configuration 1 and 4)......................................19 Figure 6. Heatsink Determination Chart (Configuration 2 and 3)......................................19 Figure 7. Heatsink Adequacy Determination Chart (Configurations 1 and 4)...................21 Read the full R.