Intel's Packaging Databook Chapter 16: Cartridge Packaging
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16.2
16.2.1
Introduction
Intel has introduced a variety of innovative package designs over the years: surface mount, small
out-line, very thin package, multilayer molded plastic quad flatpacks (PQFP), and the Tape Carrier
Package (TCP) format. Recent configurations for optimum microprocessor performance are the
Single Edge Contact (S.E.C.) cartridge and... the Mobile Mini-Cartridge.
The S.E.C. cartridge typically combines an area array packaged processor core, L2 cache, other
components, and a thermal solution attach point. The entry of the S.E.C. cartridge technology
continues the commitment to provide packaging solutions which meet Intel’s rigorous criteria for
quality and performance.
The mobile mini-cartridge is a packaging technology aimed at the notebook PC market, where
minimum form factor is required. It is designed to protect the electronic components of the product
and enables a controlled thermal interface between the processor and the thermal solution in the
notebook system (see Figure 1). The mini-cartridge provides a socketable microprocessor
solution, i.e. it enables the OEM to mount the processor via a motherboard-mounted connector,
rather than by soldering it, and mechanically securing it with screws in a manner similar to other
notebook components such as hard disk drives.
Several times throughout this chapter you will be referred to Intel’s website. The URL for the Intel
website is http://www.intel.com. Intel’s developers website can also be accessed through this site.
Single Edge Contact Cartridge Technology
The S.E.C. cartridge has the following standard features: a plastic enclosure and a substrate with an
edge finger connection. The plastic enclosure protects the surface mount components and provides
features for mechanical stability when the processor is mounted in a retention mechanism on a
motherboard. The edge finger connection maintains socketability for system configuration. There
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are two edge finger connectors: SC 242 for the Pentium II and SC 330 for the Pentium II Xeon
Processor.
There are several variations to the S.E.C. Cartridge form factor. They are the Single Edge Contact
Cartridge (S.E.C.C.) which has a cover and a thermal plate, the Single Edge Contact Cartridge 2
(S.E.C.C.2) which has a cover, but no thermal plate, and the Single Edge Processor Package
(S.E.P.P.) which has no cover or thermal plate. In implementations with no thermal plate, the
customer can attach a heatsink directly to the MP Package or die.
Terminology
The following terms are used in this document and are explained here for clarification.
S.E.C. cartridge— The processor packaging technology is called a "Single Edge Contact
cartridge."
S.E.P.P.— The processor packaging technology known as “Single Edge Processor Package.”
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Processor substrate— The structure on which the components are mounted inside the S.E.C.
cartridge (with or without components attached).
Processor core— The processor's execution engine.
Thermal plate— The surface used to connect a heatsink or other thermal solutions to the S.E.C.C
processor.
Cover— The processor casing on the opposite side of the processor core.
Figure 16-1. S.E.C. Cartridge 2— Isometric Views
Front View
Back View
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Figure 16-2. S.E.P.P— Isometric Views
Front View
Back View
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