Intel® 伺服器晶片組

適用於伺服器、工作站、網路及其他裝置的 Intel® 企業級晶片組可應用在多種領域,從大規模雲端資料中心和 HPC 叢集到網路和儲存,甚至是到中小企業都可以。這幾款晶片組提供許多功能,再加上支援企業儲存,以及額外的 I/O 頻寬,可處理高要求的企業工作負載。

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Intel® 伺服器晶片組

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PCI Express 修訂版
USB 修訂版
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散熱設計功耗
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Intel® C242 Chipset Launched Gen3 3.1 6 W
Intel® C246 Chipset Launched Gen3 3.1/2.0 6 W
Mobile Intel® CM246 Chipset Launched 8 GT/s 3.0 3.1/2.0 3 W
Intel® C422 Chipset Launched 8 GT/s 3.0 3.1 Gen1/2.0 6 W
Intel® C612 晶片組 Launched 5 GT/s Gen 2 3.0 and 2.0 7 W
Intel® 通訊晶片組 8925 Discontinued Gen 2 Endpoint 2.0 17 W
Intel® 通訊晶片組 8926 Launched Gen 2 Endpoint 2.0 17 W
Intel® 通訊晶片組 8950 Launched Gen 2 Endpoint 2.0 20 W
Intel® 通訊晶片組 8955 Discontinued Gen 2 Endpoint 2.0 20 W
Intel® 通訊晶片組 8920 Discontinued Gen 1 2.0 12 W
Intel® 通訊晶片組 8900 Discontinued Gen 1 2.0 8.5 W
Intel® 通訊晶片組 8903 Discontinued Gen 1 2.0 9.5 W
Intel® 通訊晶片組 8910 Discontinued Gen 1 2.0 11 W
Intel® C621A Chipset Launched Gen 3 3 15 W
Intel® C627A Chipset Launched Gen 3 3 28.6 W
Intel® C629A Chipset Launched Gen 3 3 28.6 W
Intel® C629 Chipset Launched Gen 3 3 28.6 W
Intel® C627 晶片組 Launched Gen 3 3 28.6 W
Intel® C625 晶片組 Launched Gen 3 3 21 W
Intel® C624 晶片組 Launched Gen 3 3 19 W
Intel® C622 晶片組 Launched Gen 3 3 17 W
Intel® C626 晶片組 Launched Gen 3 3 23 W
Intel® C621 晶片組 Launched Gen 3 3 15 W
Intel® C628 晶片組 Launched Gen 3 3 26.3 W
Intel® C222 晶片組 Discontinued 2.0 3.0/2.0
Intel® C224 晶片組 Discontinued 2.0 3.0/2.0
Intel® C226 晶片組 Launched 2.0 3.0/2.0 4.1 W
筆記型 Intel® CM238 晶片組 Launched 8 GT/s 3.0 3.0/2.0 3.67 W
Intel® C232 晶片組 Launched 8 GT/s 3.0 3.0/2.0 6 W
Intel® C236 晶片組 Launched 8 GT/s 3.0 3.0/2.0 6 W
筆記型 Intel® CM236 晶片組 Launched 8 GT/s 3.0 3.0/2.0 3.67 W
Intel® C216 晶片組 Discontinued 2.0 3.0/2.0 6.7 W
Intel® C602J 晶片組 Discontinued 2.0 2.0 8 W
Intel® C608 晶片組 Discontinued 2.0 2.0 12 W
Intel® C606 晶片組 Discontinued 2.0 2.0 12 W
Intel® C604 晶片組 Discontinued 2.0 2.0 8 W
Intel® C602 晶片組 Discontinued 2.0 2.0 8 W
Intel® C206 晶片組 Discontinued 2.0 2.0
Intel® C204 晶片組 Discontinued 2.0 2.0
Intel® C202 晶片組 Discontinued 2.0 2.0

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