適用於 IoT 邊緣的第 13 代 Intel® Core™ 處理器

搭載適用於 IoT的第 13 代 Intel® Core™ 處理器，在最需要的地方提供強大的效能與平台靈活性，為運算密集型邊緣使用案例帶來更多核心和記憶體。這一代處理器使用效能混合架構，1有多達 24 個核心和 32 個執行緒，與前一代 Intel® 酷睿™處理器相比，單執行緒效能快達 1.04 倍，多執行緒效能達 1.34 倍，CPU 影像分類推斷效能達 1.25 倍。2

設計功能強大、靈活的平台，能運行更多同步應用程式和裝置，高達 DDR5-5600 記憶體、PCIe* 5.0 連線能力，以及特定 SKU 上更多的 L2 及 L3 快取記憶體。

高階功能例如使用 Intel® 深度學習增強 (Intel® DL Boost) 提升硬體性能，以及使用向量神經網路指令 (VNNI) 突破 AI 專案的限制。第 13 代 Intel® Core™ 處理器也透過 Xe 架構驅動的 Intel® UHD Graphics 支援引人入勝的影片和數位招牌體驗。3

查看產品簡介與資訊圖。

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比較產品

產品與效能資訊

1處理器核心 (P+E) 效能混合式架構在單一處理器裸晶晶粒，結合了效能核心（P 核心）與效率核心（E 核心）這兩款全新的核心微架構。特定第 13 代 Intel® Core™ 處理器（某些第 13 代 Intel® Core™ i3 處理器和更舊版本）沒有效能混合式架構，僅有 P-core。
2效能因使用情形、配置和其他因素而異。如要進一步瞭解，請造訪 https://edc.intel.com/content/www/tw/zh/products/performance/benchmarks/internet-of-things/.
3於特定 SKU 提供。