Built with Purpose, Designed for Performance.

Break free from the limitations of legacy data center SSD form factors with the revolutionary new E1.L and E1.S Intel® SSDs based on EDSFF*. Featuring a common connector and pinout, the array of flexible, future-ready features enable a broad range of interoperable designs. Purpose-built to meet your toughest storage challenges and to always be the perfect fit.

Simply Revolutionary

Designed from the ground up, these revolutionary new EDSFF-based SSDs deliver flexible building blocks for scalable solutions, increased operational efficiency at scale and space-efficient capacity consolidating the storage footprint.

EDSFF was created to limit storage form factor proliferation by defining revolutionary industry standard form factors. This was driven by three guiding principles: enable scale, optimize total cost of ownership, and enable a dynamic range of solutions.

These principles were driven by key data center storage challenges, as surveyed from top IT decision makers: ability to scale capacity to support data and application growth, driving down the cost of storage—lowering operating and capital expenditures, while increasing storage agility, and to deliver required application performance without compromises. With a healthy and growing ecosystem, Intel supports EDSFF as the data center form factor standard of the future.

Now You Have Options

The E1.L and E1.S give you options for a variety of data center needs.

E1.L is a purpose-built form factor optimized for disaggregated systems. Providing high per server capacity, enabling up to 32 drives per rack unit for massive storage power. In addition to capacity, this form factor provides key features of thermal efficiency, full serviceability, scalability, and future ready performance.

E1.S provides the best of U.2 and M.2. E1.S in a scalable, flexible, power, and thermally efficient SSD building block. This form factor was designed for high volume hyperscale, and allows system flexibility, increased storage density, modular scaling, improved serviceability, and more efficient cooling optimized for 1U servers.

Optimized Capacity

EDSFF drives were designed to optimize capacity per drive. With 36 media sites on the E1.L this drive can scale to higher capacities without expensive and complex die stacking. The Intel SSD E1.L will scale up to 30.72TB of capacity in 2019.1 Using the 30.72TB E1.L form factor, you will be able to reach nearly 1PB of storage in 1U.2 This provides up to 10 times rack consolidation3 compared to 8TB U.2 15mm drives.

Space Isn’t All it Saves

E1.L provides programmable LEDs to quickly locate failed drives, offline drives, and un-populated slots. With a carrier-less design and an integrated latch, the E1.L removes the need for drive carriers. Advanced enclosure management with slot level power control enables single drive isolation. The E1.L is up to 2 times more thermally efficient than U.2 15mm drives,4while the E1.S is up to 3 times more thermally efficient than U.2 7mm drives.5 With a combination of built in serviceability and thermal efficiency, EDSFF drives allow you to increase operational efficiency at scale.



資料來源 – Intel。比較維持相等溫度所需的氣流:4TB U.2 15mm Intel® SSD DC P4500 以及 4TB EDSFF 式外型規格的 Intel® SSD DC P4500。結果係採用內部分析或架構模擬或模型化進行預估或模擬,僅供參考之用。模擬涉及伺服器的金屬板外表中每一種外型規格的三部磁碟機:12.5mm 間距的 EDSFF 式外型規格、1000m 高度、限制機殼溫度 70°C 上的固態硬碟或溫控調頻效能,以先到達者為準。5°C 防護帶。結果用於替代符合 EDSFF 規格之外型的 Intel® SSD P4510 的預計氣流。


資料來源 – Intel。比較維持相等溫度所需的氣流:8TB U.2 7mm Intel® SSD DC P4500 以及 8TB EDSFF E1.S 外型規格的 Intel® SSD DC P4510。結果係採用內部分析或架構模擬或模型化進行預估或模擬,僅供參考之用。模擬涉及比較每一外型規格的 1U 伺服器實作。E1.S 採 11mm 間距的垂直方向,而 U.2 7mm 採 18mm 間距的水平方向。兩種外型規格都以伺服器的金屬板外表圍繞。每一種外型規格都受限於起始溫控調頻功能的條件。


資料來源 - Intel。30.72TB EDSFF 型固態硬碟將於 2019 年推出。此處提供的所有資訊可能變更,恕不另行通知。若要取得最新的 Intel® 產品規格與發展藍圖,請聯絡您的 Intel 代表。


資料來源 - Intel。總計 983TB,使用 32 個 30.72TB 的固態硬碟;每一 1U 節點 32 個固態硬碟,使用 E1.L 外型規格。依據未來上市的 30.72TB Intel® SSD D5-P4326。


資料來源 - Intel。比較 983TB 的 32 個 Intel® SSD D5-P4326 30.72TB(日後上市)的 1 機架單位;以及 960TB 的 Intel® SSD DC P4500 8TB 的 10 機架單位。

Intel® 技術的功能與優勢取決於系統配置,而且可能需要支援的硬體、軟體或服務啟動才能使用。若想進一步瞭解,請前往 intel.com,或洽 OEM 或零售商。

Intel 並不提供任何明示或暗示之擔保,包括但不限於關於適售性、適合特定用途、不侵犯權利的暗示擔保,以及任何因執行過程、交易過程或用於業務中而造成的擔保。