英特爾揭曉氣勢盛大的Xeon多年產品藍圖，加速資料中心領先地位與成長

新聞焦點

• 自2022年第一季開始，英特爾將採用Intel 7提供Sapphire Rapids，為市場帶來最豐富功能的Intel® Xeon®，橫跨一系列工作負載的效能表現均有顯著改善，單單AI即擁有高達30倍的效能提升目標。
• Emerald Rapids將於2023年問世，這款次世代Xeon處理器採用Intel 7製程節點，為現有平台提供更高的效能，以及延伸記憶體與安全性優勢。
• 在2024，英特爾將會推出一款以E-core為基礎的全新革命性Xeon處理器—Sierra Forest，採用Intel 3作為其高密度和極具效率的領先產品。
• 英特爾憑藉著宣布將其次世Xeon處理器—Granite Rapids ，從Intel 4升級至Intel 3，強化其Intel 3製程節點進展的信心，鞏固在資料中心的領先定位。

在英特爾2022年的投資者會議，公司首次揭曉從現在至2024年新的Intel Xeon產品藍圖。英特爾正為資料中心市場的持續成長和領先地位鋪路，其產品線將加入一款全新極具效率的處理器系列（代號Sierra Forest），關鍵產品升級至更加先進的製程節點，並為資料中心帶來新的、範圍寬廣的架構策略。這些新世代產品將為公司橫跨雲端、網路和邊緣的成長注入動力。

更多資訊: 英特爾 2022投資者會議（媒體資料） |  為我們的資料中心客戶建立高效能和有效率的未來（Lisa Spelman高階主管文章）

新架構、新領先地位產品藍圖

英特爾未來幾代Xeon的新架構策略，將有基於效能核心（P-core）和基於效率核心（E-core）的雙軌產品藍圖，從2個最佳化平台轉換成1個通用、業界定義的平台。此新路線將最大化每瓦效能、各級市場功能，以及英特爾在業界內的整體競爭力。於介紹這個新方式的同時，英特爾加強與現有龐大Xeon平台生態系的相容性，並讓客戶能夠從單一投資中獲取益處。

• Sapphire Rapids：對於採用Intel 7的P-core系列，英特爾強調Sapphire Rapids為迄今功能最為豐富的Xeon，並在數個關鍵領域擴大其資料中心的領先地位，包含AI效能和安全性功能。下個月，英特爾將開始逐步出貨 Sapphire Rapids，引領產業轉型至次世代記憶體和介面標準，包含DDR5、PCIe Gen5和新的Compute Express Link高速互連。
• Emerald Rapids：於2023年，英特爾將會使用Intel 7製程節點，推出次世代P-core處理器Emerald Rapids。這款處理器將會是相容Sapphire Rapids插槽的更新，於現有平台提供更高的效能，以及延伸記憶體與安全性優勢，為英特爾的客戶提供一個簡單採用並頗具價值的升級。
• Sierra Forest：英特爾首次展示關於Sierra Forest的細節，這是一款為資料中心設計，基於E-core的Xeon處理器。它將提供每瓦效能效率和無與倫比的密度，藉此提升總擁有成本效益。這款產品訂於2024年推出，是英特爾為超大規模客戶所設計，專為雲端運算工作負載提供獨特最佳化核心的解決方案。
• Granite Rapids：為展現對於Intel 3製程節點進展的信心，英特爾宣布Granite Rapids將從Intel 4製程升級至Intel 3製程。這款次世代P-core產品將於2024年推出，將鞏固英特爾在業界中的領先地位。

第3代Intel Xeon可擴充處理器的重要時刻

在與客戶分享英特爾資料中心新的產品藍圖與未來創新的同時，英特爾也看到了第3代Intel Xeon可擴充處理器（Ice Lake）的強勁態勢，這款處理器已為現代工作負載最佳化。英特爾已向全球客戶出貨將近2百萬顆，僅僅在2021年第四季就出貨超過1百萬。更有甚者，2021年12月Intel Xeon 的整體出貨量，超過任何一位競爭對手於2021年的全年伺服器CPU出貨量。

_{Performance varies by use, configuration and other factors. Learn more at www.Intel.com/PerformanceIndex.} 

_{Performance results are based on testing as of dates shown in configurations and may not reflect all publicly available updates.  See backup for configuration details.  No product or component can be absolutely secure.}

_{Intel contributes to the development of benchmarks by participating in, sponsoring, and/or contributing technical support to various benchmarking groups, including the BenchmarkXPRT Development Community administered by Principled Technologies.}

_{Your costs and results may vary.}

_{Intel technologies may require enabled hardware, software or service activation.}

_{Some results may have been estimated or simulated.}

_{Intel does not control or audit third-party data.  You should consult other sources to evaluate accuracy.}

_{All product plans and roadmaps are subject to change without notice.}

_{Future node performance and other metrics, including power and density, are projections and are inherently uncertain and, in the case of other industry nodes, are derived from or estimated based on publicly available information. Intel’s node numbers do not represent the actual dimension of any physical feature on a transistor or structure. They also do not pinpoint a specific level of improvement in performance, power or area, and the magnitude of a decrease from one node number to the next is not necessarily proportionate to the level of improvement in one or more metrics. Historically, new Intel node numbers were based solely on improvements in area/density; now, node numbers generally reflect a holistic assessment of improvement across metrics and can be based on improvement in one or more of performance, power, area, or other important factors, or a combination, and will not necessarily be based on area/density improvement alone.}

_{Statements in this presentation contain forward-looking statements relating to Intel’s business outlook, future plans and expectations, including with respect to Intel’s process and packaging technology roadmap and schedules; innovation cadence; future technology, services, and products and the expected benefits and availability of such technologies, services, and products, including PowerVia and RibbonFET technologies, future process nodes, and other technologies and products; future use of EUV and other manufacturing tools and technologies; expectations regarding suppliers, partners, and customers; Intel’s strategy and its anticipated benefits; product and manufacturing plans, goals, timelines, ramps, progress, and future product and process leadership and performance; future manufacturing capacity; manufacturing expansion and investment plans; plans and goals related to Intel’s foundry business; business plans; financial projections and expectations; total addressable market (TAM) and market opportunity; future economic conditions; future impacts of the COVID-19 pandemic; future legislation; future capital offsets; pending or future transactions; the proposed Mobileye IPO; supply expectations including regarding industry shortages; future external foundry usage; expectations regarding customers, including designs, wins, orders, and partnerships; projections regarding competitors; ESG goals; and anticipated trends in our businesses or the markets relevant to them, including future demand, market share, industry growth, and technology trends. Such statements involve a number of risks and uncertainties. Words such as “anticipates,” “expects,” “intends,” “goals,” “plans,” “believes,” “seeks,” “estimates,” “commits,” “continues,” “may,” “will,” “would,” “should,” “could,” “strategy,” “progress,” “path,” “positioned,” “ramp,” “momentum,” “accelerate,” “on-track,” “roadmap,” “pipeline,” “cadence,” “schedule,” “forecast,” “likely,” “guide,” “potential,” “next gen,” “future,”  and “deliver” and variations of such words and similar expressions are intended to identify forward-looking statements. Statements that refer to or are based on estimates, forecasts, projections, and uncertain events or assumptions also identify forward-looking statements. Such statements involve many risks and uncertainties that could cause actual results to differ materially from those expressed or implied in these forward-looking statements. Important factors that could cause actual results to differ materially from the company’s expectations include, among others, Intel’s failure to realize the anticipated benefits of its strategy and plans; changes in plans due to business, economic, or other factors; actions taken by competitors, including changes in competitor technology roadmaps; changes impacting our projections regarding our technology or competing technology; delays in development or implementation of our future manufacturing technologies or failures to realize the anticipated benefits of such technologies, including expected improvements in performance and other factors; delays or changes in the design or introduction of future products; changes in customer needs and technology trends; our ability to rapidly respond to technological developments; delays, changes in plans, or other disruptions involving manufacturing tool and other suppliers; and other factors set forth in Intel’s earnings release dated January 26, 2022, which is included as an exhibit to Intel’s Form 8-K furnished with the Securities and Exchange Commission (SEC) on such date, and in Intel’s other reports filed or furnished with the SEC, including the company’s most recent reports on Forms 10-K and 10-Q. Copies of Intel’s SEC filings may be obtained by visiting our Investor Relations website at www.intc.com or the SEC’s website at www.sec.gov. All information in this presentation reflects management’s views as of February 17, 2022, unless an earlier date is indicated. Intel does not undertake, and expressly disclaims any duty, to update any statement made in this presentation, whether as a result of new information, new developments or otherwise, except to the extent that disclosure may be required by law.}