/apps/intel/productscatalog/templates/upeproductscatalog

leftIcon
rightIcon

比較 Intel® 產品

匯出比較
關鍵元件
產品集合
推出日期
狀態
預定停產
EOL 宣佈
截止訂購
Last Receipt 屬性
3 年有限保固
可以購買延長保固 (特定國家)
額外的延長保固詳細資訊
機箱外型規格
機殼尺寸
主機板外型規格
包含機架滑軌
相容產品系列
插槽
TDP
吸熱片
包含散熱器
系統主機板
主機板晶片組
目標市場
機架型便利的主機板
電源供應器
電源供應器類型
包含的電源供應器數量
複式備援風扇
支援冗餘備援電源
背板
包含的項目
產品集合
 Intel® 伺服器系統 R1000WFR 系列 Intel® 伺服器系統 R1000WFR 系列 Intel® 伺服器系統 R1000WFR 系列
推出日期
 Q3'17 Q3'17 Q3'17
狀態
 Discontinued Discontinued Discontinued
預定停產
 Q3'19 Q3'19 Q3'19
EOL 宣佈
 Monday, April 22, 2019 Monday, April 22, 2019 Monday, April 22, 2019
截止訂購
 Thursday, August 22, 2019 Thursday, August 22, 2019 Thursday, August 22, 2019
Last Receipt 屬性
 Sunday, December 22, 2019 Sunday, December 22, 2019 Sunday, December 22, 2019
3 年有限保固
 是 是 是
可以購買延長保固 (特定國家)
 是 是 是
額外的延長保固詳細資訊
 Dual Processor System Extended Warranty Dual Processor System Extended Warranty Dual Processor System Extended Warranty
機箱外型規格
 1U, Spread Core Rack 1U, Spread Core Rack 1U, Spread Core Rack
機殼尺寸
 16.93" x 27.95" x 1.72" 16.93" x 27.95" x 1.72" 16.93" x 27.95" x 1.72"
主機板外型規格
 Custom 16.7" x 17" Custom 16.7" x 17" Custom 16.7" x 17"
包含機架滑軌
 否 否 否
相容產品系列
 Intel® Xeon® Scalable Processors Intel® Xeon® Scalable Processors Intel® Xeon® Scalable Processors
插槽
 Socket P Socket P Socket P
TDP
 165 W 165 W 165 W
吸熱片
 (2) 1U Standard Heat Sink FXXCA78X108HS (2) 1U Standard Heat Sink FXXCA78X108HS (2) 1U Standard Heat Sink FXXCA78X108HS
包含散熱器
 是 是 是
系統主機板
 Intel® Server Board S2600WF0 Intel® Server Board S2600WFT Intel® Server Board S2600WFT
主機板晶片組
 Intel® C624 晶片組 Intel® C624 晶片組 Intel® C624 晶片組
目標市場
 Cloud/Datacenter Full-featured Full-featured
機架型便利的主機板
 是 是 是
電源供應器
 1100 W 1100 W 1100 W
電源供應器類型
 AC AC AC
包含的電源供應器數量
 1 1 1
複式備援風扇
 否 否 否
支援冗餘備援電源
 Supported, requires additional power supply Supported, requires additional power supply Supported, requires additional power supply
背板
 Included Included Included
包含的項目
 (1) Intel® Server Board S2600WF0 (No onboard LAN) S2600WF0, (2) Riser card assembly with 1 slot PCIe x16 riser card F1UL16RISER3, (4) 3.5” Hot-swap drive bays with drive carriers and drive blanks: Includes (1) 12 Gb SAS backplane FR1304S3HSBP, (4) 3.5” hot swap drive tool less carriers FXX35HSCAR2, (1) Standard control panel assembly FXXFPANEL2, (1) Front I/O Panel assembly (VGA and 2 x USB), (1) 150mm Backplane I2C cable, (1) 850mm MiniSAS HD Cable AXXCBL850HDHRT, (1) 350mm Backplane power cable, (1) Air duct, (6) Dual rotor system fans FR1UFAN10PW, (8) DIMM slot blanks, (1) Chassis Stiffener Bar, (1) 1100W power supply module AXX1100PCRPS, (2) CPU heat sinks, 39 fin passive, (2) CPU heat sink “No CPU” Label inserts, (2) Standard CPU Carrier, (1) Power supply bay blank insert, (2) Chassis handle (1 set) installed A2UHANDLKIT3, (2) AC Power Cord retention strap assembly (1) Intel® Server Board S2600WFT (Dual 10GbE LAN) S2600WFT, (2) Riser card assembly with 1 slot PCIe x16 riser card F1UL16RISER3, (4) 3.5” Hot-swap drive bays with drive carriers and drive blanks: Includes (1) 12 Gb SAS backplane FR1304S3HSBP, (4) 3.5” hot swap drive tool less carriers FXX35HSCAR2, (1) Standard control panel assembly FXXFPANEL2, (1) Front I/O Panel assembly (VGA and 2 x USB), (1) 150mm Backplane I2C cable, (1) 850mm MiniSAS HD Cable AXXCBL850HDHRT, (1) 350mm Backplane power cable, (1) Air duct, (6) Dual rotor system fans FR1UFAN10PW, (8) DIMM slot blanks, (1) Chassis Stiffener Bar, (1) 1100W power supply module AXX1100PCRPS, (2) CPU heat sinks FXXCA78X108HS, (2) CPU heat sink “No CPU” Label inserts, (2) Standard CPU Carrier, (1) Power supply bay blank insert, (2) Chassis handle (1 set) installed A2UHANDLKIT3, (2) AC Power Cord retention strap assembly (1) Intel® Server Board S2600WFT (Dual 10GbE LAN) S2600WFT, (2) Riser card assembly with 1 slot PCIe x16 riser card F1UL16RISER3, (8) 2.5” Hot-swap drive bays with drive carriers and drive blanks: Includes (1) SAS/NVMe Combo backplane F1U8X25S3PHS, (8) 2.5” hot swap drive tool less carriers FXX25HSCAR3, (1) Pre-installed Standard Control Panel assembly FXXFPANEL2, (1) – Pre-installed Front I/O Panel assembly (VGA and 2 x USB), (1) 200mm Backplane I2C cable, (1) 650mm MiniSAS HD Cable AXXCBL650HDHRT, (1) 850mm MiniSAS HD Cable AXXCBL850HDHRS, (1) 400mm Backplane power cable, (1) Air duct, (6) Dual rotor system fans FR1UFAN10PW, (8) DIMM slot blanks, (1) Chassis Stiffener Bar, (1) 1100W power supply module AXX1100PCRPS, (2) CPU heat sinks FXXCA78X108HS, (2) CPU heat sink “No CPU” Label inserts, (2) Standard CPU Carrier, (1) Power supply bay blank insert, (2) Chassis handle (1 set) installed A2UHANDLKIT3, (2) AC Power Cord retention strap assembly
產品集合
 Intel® 伺服器系統 R1000WFR 系列 Intel® 伺服器系統 R1000WFR 系列 Intel® 伺服器系統 R1000WFR 系列
推出日期
 Q3'17 Q3'17 Q3'17
狀態
 Discontinued Discontinued Discontinued
預定停產
 Q3'19 Q3'19 Q3'19
EOL 宣佈
 Monday, April 22, 2019 Monday, April 22, 2019 Monday, April 22, 2019
截止訂購
 Thursday, August 22, 2019 Thursday, August 22, 2019 Thursday, August 22, 2019
Last Receipt 屬性
 Sunday, December 22, 2019 Sunday, December 22, 2019 Sunday, December 22, 2019
3 年有限保固
 是 是 是
可以購買延長保固 (特定國家)
 是 是 是
額外的延長保固詳細資訊
 Dual Processor System Extended Warranty Dual Processor System Extended Warranty Dual Processor System Extended Warranty
機箱外型規格
 1U, Spread Core Rack 1U, Spread Core Rack 1U, Spread Core Rack
機殼尺寸
 16.93" x 27.95" x 1.72" 16.93" x 27.95" x 1.72" 16.93" x 27.95" x 1.72"
主機板外型規格
 Custom 16.7" x 17" Custom 16.7" x 17" Custom 16.7" x 17"
包含機架滑軌
 否 否 否
相容產品系列
 Intel® Xeon® Scalable Processors Intel® Xeon® Scalable Processors Intel® Xeon® Scalable Processors
插槽
 Socket P Socket P Socket P
TDP
 165 W 165 W 165 W
吸熱片
 (2) 1U Standard Heat Sink FXXCA78X108HS (2) 1U Standard Heat Sink FXXCA78X108HS (2) 1U Standard Heat Sink FXXCA78X108HS
包含散熱器
 是 是 是
系統主機板
 Intel® Server Board S2600WF0 Intel® Server Board S2600WFT Intel® Server Board S2600WFT
主機板晶片組
 Intel® C624 晶片組 Intel® C624 晶片組 Intel® C624 晶片組
目標市場
 Cloud/Datacenter Full-featured Full-featured
機架型便利的主機板
 是 是 是
電源供應器
 1100 W 1100 W 1100 W
電源供應器類型
 AC AC AC
包含的電源供應器數量
 1 1 1
複式備援風扇
 否 否 否
支援冗餘備援電源
 Supported, requires additional power supply Supported, requires additional power supply Supported, requires additional power supply
背板
 Included Included Included
包含的項目
 (1) Intel® Server Board S2600WF0 (No onboard LAN) S2600WF0, (2) Riser card assembly with 1 slot PCIe x16 riser card F1UL16RISER3, (4) 3.5” Hot-swap drive bays with drive carriers and drive blanks: Includes (1) 12 Gb SAS backplane FR1304S3HSBP, (4) 3.5” hot swap drive tool less carriers FXX35HSCAR2, (1) Standard control panel assembly FXXFPANEL2, (1) Front I/O Panel assembly (VGA and 2 x USB), (1) 150mm Backplane I2C cable, (1) 850mm MiniSAS HD Cable AXXCBL850HDHRT, (1) 350mm Backplane power cable, (1) Air duct, (6) Dual rotor system fans FR1UFAN10PW, (8) DIMM slot blanks, (1) Chassis Stiffener Bar, (1) 1100W power supply module AXX1100PCRPS, (2) CPU heat sinks, 39 fin passive, (2) CPU heat sink “No CPU” Label inserts, (2) Standard CPU Carrier, (1) Power supply bay blank insert, (2) Chassis handle (1 set) installed A2UHANDLKIT3, (2) AC Power Cord retention strap assembly (1) Intel® Server Board S2600WFT (Dual 10GbE LAN) S2600WFT, (2) Riser card assembly with 1 slot PCIe x16 riser card F1UL16RISER3, (4) 3.5” Hot-swap drive bays with drive carriers and drive blanks: Includes (1) 12 Gb SAS backplane FR1304S3HSBP, (4) 3.5” hot swap drive tool less carriers FXX35HSCAR2, (1) Standard control panel assembly FXXFPANEL2, (1) Front I/O Panel assembly (VGA and 2 x USB), (1) 150mm Backplane I2C cable, (1) 850mm MiniSAS HD Cable AXXCBL850HDHRT, (1) 350mm Backplane power cable, (1) Air duct, (6) Dual rotor system fans FR1UFAN10PW, (8) DIMM slot blanks, (1) Chassis Stiffener Bar, (1) 1100W power supply module AXX1100PCRPS, (2) CPU heat sinks FXXCA78X108HS, (2) CPU heat sink “No CPU” Label inserts, (2) Standard CPU Carrier, (1) Power supply bay blank insert, (2) Chassis handle (1 set) installed A2UHANDLKIT3, (2) AC Power Cord retention strap assembly (1) Intel® Server Board S2600WFT (Dual 10GbE LAN) S2600WFT, (2) Riser card assembly with 1 slot PCIe x16 riser card F1UL16RISER3, (8) 2.5” Hot-swap drive bays with drive carriers and drive blanks: Includes (1) SAS/NVMe Combo backplane F1U8X25S3PHS, (8) 2.5” hot swap drive tool less carriers FXX25HSCAR3, (1) Pre-installed Standard Control Panel assembly FXXFPANEL2, (1) – Pre-installed Front I/O Panel assembly (VGA and 2 x USB), (1) 200mm Backplane I2C cable, (1) 650mm MiniSAS HD Cable AXXCBL650HDHRT, (1) 850mm MiniSAS HD Cable AXXCBL850HDHRS, (1) 400mm Backplane power cable, (1) Air duct, (6) Dual rotor system fans FR1UFAN10PW, (8) DIMM slot blanks, (1) Chassis Stiffener Bar, (1) 1100W power supply module AXX1100PCRPS, (2) CPU heat sinks FXXCA78X108HS, (2) CPU heat sink “No CPU” Label inserts, (2) Standard CPU Carrier, (1) Power supply bay blank insert, (2) Chassis handle (1 set) installed A2UHANDLKIT3, (2) AC Power Cord retention strap assembly
補充資訊
描述
描述
 Integrated 1U system featuring an Intel® Server Board S2600WFT with four 3.5 inch hot-swap drives, 24 DIMMs, one 1100W redundant-capable power supply, Intel® OCP Module for adding additional features without losing a PCIe add-in slot Integrated 1U system featuring an Intel® Server Board S2600WFT with Dual 10GbE LAN, four 3.5 inch hot-swap drives, 24 DIMMs, one 1100W redundant-capable power supply, Intel® OCP Module for adding additional features without losing a PCIe add-in slot Integrated 1U system featuring an Intel® Server Board S2600WFT with Dual 10GbE LAN, eight 2.5 inch hot-swap drives, 24 DIMMs, one 1100W redundant-capable power supply, Intel® OCP Module for adding additional features without losing a PCIe add-in slot
描述
 Integrated 1U system featuring an Intel® Server Board S2600WFT with four 3.5 inch hot-swap drives, 24 DIMMs, one 1100W redundant-capable power supply, Intel® OCP Module for adding additional features without losing a PCIe add-in slot Integrated 1U system featuring an Intel® Server Board S2600WFT with Dual 10GbE LAN, four 3.5 inch hot-swap drives, 24 DIMMs, one 1100W redundant-capable power supply, Intel® OCP Module for adding additional features without losing a PCIe add-in slot Integrated 1U system featuring an Intel® Server Board S2600WFT with Dual 10GbE LAN, eight 2.5 inch hot-swap drives, 24 DIMMs, one 1100W redundant-capable power supply, Intel® OCP Module for adding additional features without losing a PCIe add-in slot
記憶體與儲存裝置
記憶體類型
最大 DIMM 數量
最大記憶體大小 (取決於記憶體類型)
支援的前端硬碟機數量
前端硬碟機外型規格
支援的內部硬碟機數量
內部硬碟機外型規格
記憶體類型
 Registered/Load Reduced DDR4-2133/2400/2666 MHz Registered/Load Reduced DDR4-2133/2400/2666 MHz Registered/Load Reduced DDR4-2133/2400/2666 MHz
最大 DIMM 數量
 24 24 24
最大記憶體大小 (取決於記憶體類型)
 1.5 TB 1.5 TB 1.5 TB
支援的前端硬碟機數量
 4 4 8
前端硬碟機外型規格
 Hot-swap 3.5" HDD or 2.5" SSD Hot-swap 3.5" HDD or 2.5" SSD Hot-swap 2.5"
支援的內部硬碟機數量
 2 2 2
內部硬碟機外型規格
 M.2 SSD M.2 SSD M.2 SSD
記憶體類型
 Registered/Load Reduced DDR4-2133/2400/2666 MHz Registered/Load Reduced DDR4-2133/2400/2666 MHz Registered/Load Reduced DDR4-2133/2400/2666 MHz
最大 DIMM 數量
 24 24 24
最大記憶體大小 (取決於記憶體類型)
 1.5 TB 1.5 TB 1.5 TB
支援的前端硬碟機數量
 4 4 8
前端硬碟機外型規格
 Hot-swap 3.5" HDD or 2.5" SSD Hot-swap 3.5" HDD or 2.5" SSD Hot-swap 2.5"
支援的內部硬碟機數量
 2 2 2
內部硬碟機外型規格
 M.2 SSD M.2 SSD M.2 SSD
擴充選擇
PCIe x24 擴充超級插槽
Intel® I/O 擴充模組 x8 第 3 代的連接器
Intel® 整合式 RAID 模組的連接器
擴充卡插槽 1：包含插槽配置
擴充卡插槽 2：包含插槽配置
Riser Slot 1: Total # of Lanes
Riser Slot 2: Total # of Lanes
PCIe x24 擴充超級插槽
 2 2 2
Intel® I/O 擴充模組 x8 第 3 代的連接器
 1 1 1
Intel® 整合式 RAID 模組的連接器
 1 1 1
擴充卡插槽 1：包含插槽配置
 1x PCIe Gen3 x16 1x PCIe Gen3 x16 1x PCIe Gen3 x16
擴充卡插槽 2：包含插槽配置
 1x PCIe Gen3 x16 1x PCIe Gen3 x16 1x PCIe Gen3 x16
Riser Slot 1: Total # of Lanes
 24 24
Riser Slot 2: Total # of Lanes
 24 24
PCIe x24 擴充超級插槽
 2 2 2
Intel® I/O 擴充模組 x8 第 3 代的連接器
 1 1 1
Intel® 整合式 RAID 模組的連接器
 1 1 1
擴充卡插槽 1：包含插槽配置
 1x PCIe Gen3 x16 1x PCIe Gen3 x16 1x PCIe Gen3 x16
擴充卡插槽 2：包含插槽配置
 1x PCIe Gen3 x16 1x PCIe Gen3 x16 1x PCIe Gen3 x16
Riser Slot 1: Total # of Lanes
 24 24
Riser Slot 2: Total # of Lanes
 24 24
I/O 規格
USB 連接埠數量
SATA 連接埠總數
RAID 配置
序列埠數量
整合式區域網路
LAN 連接埠數目
Optical Drive Support
USB 連接埠數量
 5 5 5
SATA 連接埠總數
 10 10 10
RAID 配置
 SW RAID 0, 1, 10, optional 5 SW RAID 0, 1, 10, optional 5 SW RAID 0, 1, 10, optional 5
序列埠數量
 2 2 2
整合式區域網路
 1G (mgmt) only 2x 10GbE 2x 10GbE
LAN 連接埠數目
 1 2 2
Optical Drive Support
 是 是
USB 連接埠數量
 5 5 5
SATA 連接埠總數
 10 10 10
RAID 配置
 SW RAID 0, 1, 10, optional 5 SW RAID 0, 1, 10, optional 5 SW RAID 0, 1, 10, optional 5
序列埠數量
 2 2 2
整合式區域網路
 1G (mgmt) only 2x 10GbE 2x 10GbE
LAN 連接埠數目
 1 2 2
Optical Drive Support
 是 是
封裝規格
最大 CPU 配置
最大 CPU 配置
 2 2 2
最大 CPU 配置
 2 2 2
進階技術
可支援 Intel® Optane™ 記憶體 ‡
Intel® 遠端管理功能模組
含有 IPMI 整合式 BMC
Intel® Node Manager
Intel® On-Demand Redundant Power
Intel® 進階管理技術
Intel® Server Customization Technology
Intel® Build Assurance Technology
Intel® 效率電源技術
Intel® 靜音散熱技術
適用於導向式 I/O 的 Intel® 虛擬化技術 (VT-d) ‡
Intel® 快速儲存技術企業版
Intel® 靜音系統技術
Intel® 快速記憶體存取技術
Intel® Flex Memory Access
TPM 版本
可支援 Intel® Optane™ 記憶體 ‡
 是 是 是
Intel® 遠端管理功能模組
 是 是 是
含有 IPMI 整合式 BMC
 IPMI 2.0 & Redfish IPMI 2.0 & Redfish IPMI 2.0 & Redfish
Intel® Node Manager
 是 是 是
Intel® On-Demand Redundant Power
 是 是 是
Intel® 進階管理技術
 是 是 是
Intel® Server Customization Technology
 是 是 是
Intel® Build Assurance Technology
 是 是 是
Intel® 效率電源技術
 是 是 是
Intel® 靜音散熱技術
 是 是 是
適用於導向式 I/O 的 Intel® 虛擬化技術 (VT-d) ‡
 是 是 是
Intel® 快速儲存技術企業版
 是 是 是
Intel® 靜音系統技術
 是 是 是
Intel® 快速記憶體存取技術
 是 是 是
Intel® Flex Memory Access
 是 是 是
TPM 版本
 2.0 2.0 (optional module) 2.0 (optional module)
可支援 Intel® Optane™ 記憶體 ‡
 是 是 是
Intel® 遠端管理功能模組
 是 是 是
含有 IPMI 整合式 BMC
 IPMI 2.0 & Redfish IPMI 2.0 & Redfish IPMI 2.0 & Redfish
Intel® Node Manager
 是 是 是
Intel® On-Demand Redundant Power
 是 是 是
Intel® 進階管理技術
 是 是 是
Intel® Server Customization Technology
 是 是 是
Intel® Build Assurance Technology
 是 是 是
Intel® 效率電源技術
 是 是 是
Intel® 靜音散熱技術
 是 是 是
適用於導向式 I/O 的 Intel® 虛擬化技術 (VT-d) ‡
 是 是 是
Intel® 快速儲存技術企業版
 是 是 是
Intel® 靜音系統技術
 是 是 是
Intel® 快速記憶體存取技術
 是 是 是
Intel® Flex Memory Access
 是 是 是
TPM 版本
 2.0 2.0 (optional module) 2.0 (optional module)
Intel® 透明供應鏈
包含合規聲明和平台認證
包含合規聲明和平台認證
 是 是 是
包含合規聲明和平台認證
 是 是 是
比較產品